The 7th International Conference on 3D Imaging Technologies - Multidimensional Signal Processing and Deep Learning
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Nov 21, 2025 Nov 23, 2025
E-mail:
ic3dit@163.com
The 7th International Conference on 3D Imaging Technologies - Multidimensional Signal Processing and Deep Learning (3DIT-MSP&DL2025) will be held on Nov 21-23, 2025 in Sanya, China. The 3DIT-MSP&DL2025 aims to provide a forum that brings together researchers and academia as well as practitioners from industry to meet and exchange their ideas and recent research development work on all aspects of Images, their applications and other related areas. The focus of the conference is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students from all over the world. A key aspect of this conference is the strong mixture of academia and industry. This conference brings the experts, practitioners, scientists and decision-makers from academia and industry together. Our aim is to foster a strong, lively and well-connected international research community. We welcome innovative ideas, concepts, services, techniques, research outputs and business practices. |  |
Opening Date Jul 15, 2025 | Submission Deadline Aug 1, 2025 | Notification Sept 15, 2025 | Camera Ready Oct 15, 2025 | Conference Date Nov 21-23, 2025 |
All papers, both invited and contributed, will be reviewed by at least 2 experts from the committees. After a careful reviewing process, the final decision and detailed presentation at the conference. All the accepted papers will be submitted to Top Publishing Housing.
1. Presentation & Publication
1) Full Papers will be invited to give the presentation,and the paper will be published in the 3DIT-MSP&DL2025 conference proceedings.
2) English is the official language of the conference; the paper should be written and presented only in English.
3) Each paper should be at least 10 pages or longer.
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